Solder Pots & Fluxing

Automatic Wave Soldering Machines have the following sections:

  • Fluxer Section
  • Pre-heater Section
  • Wave Soldering Section
Through the wave soldering section the circuit boards are passed to the conveyor. A microprocessor is embedded which monitors all the major process parameters. The most important parameter to control is - temperature of the boards coming out of the pre-heater section. Two axially placed banks of heaters are responsible for carrying out the preheating process, out of the two the one which is upstream supplies major chunk of heat and the one that is downstream supplies enough heat to enhance the temperature of the system to the desired value. The heat radiated from the boards is tracked and noted by a pyrometer situated between the two banks of heaters, and this information is processed by the microprocessor and transformed into appropriate instruction code to be passed on the second band of heaters. A solder pot assembly is present in the soldering section designed to conform to the mechanical nature of the system. The solder pot height can be manipulated according to the length of the leads on the board.

An automatic wave solder machine has printed circuit boards which are transferred to the wave soldering segment for solder application unclad metallic surfaces underneath the surface of the circuit boards. An outlet wire is provided on the rear side of the discharge nozzle for the solder wave loaded with spring upwards for contact with a stop member. The solder pot assemble may be positioned low and taken out of the circuit board path to cleanse, in doing so both the rear and front plate stop members on either side of the discharge nozzle are hanged so that both these plates can be raised for cleaning when the solder pot in positioned low. Due to the presence of the stop member the height of the discharge nozzle can be manipulated according to the specific requirements, in spite of this it retains the spring loaded wire at the mentioned height.

A.C.E. Production Technologies, leader in selective soldering machines & systems, has introduced Dual Head Fluxer option in its range of selective wave soldering machines that facilitate instant changeover of flux types. The Dual Head Fluxer is especially designed keeping in mind the needs of selective soldering operations that demand instant change over from leaded to lead free solders which are a major concern among technicians making a transition to lead-free solders.

This new feature enriches our highly compatible KISS 102 programmable selective soldering system. The inclusion of a dual head fluxing system makes it possible to change flux stratums instantly and supplements the nippy solder pot transition time that is a hallmark of our systems.

The dual head flux system is a spray type system, with spray point size that can be regulated according to specific requirements, pattern and deposition volume. The spray head can be controlled up to a precision spot size of 2mm and is completely maintenance-free. KISS selective soldering systems, an innovative variant of wave soldering systems by A.C.E Production Technologies', implements swappable solder pots which make it easy in the transitioning process to keep the lead bearing and lead-free solders distinctively separate.