Initial Set-up

The Operator spreads the rails and positions the board on the rails pushing the board in contact with the board location stops.

With the use of the pointer laser the pot is moved in the Y axis until the laser beam shines onto the centerline of the pin array. The Y index detent or bar is clamped in place securing the relationship of the solder wave to centerline of the soldering path.

The Operator uses the joystick while watching the laser beam travel over the top side of the connector. The solder pot X axis is positioned to the left side of the connector until the laser beam shines directly onto the connector "start position". The left X limit switch is set locking the travel limit. Then the solder pot is jogged to the right until the laser beam shines directly onto the connector "end position". The right X limit switch is set locking that travel limit in place. All limits may be fine tuned if necessary.

The Z height (contact of the solder wave to the PCB) is usually consistent between products as the reference surface is where all product will be located on the rail. The Z can be adjusted quite easily if needed using the joystick and the adjustment screw.

Make sure the temperature is correct (the solder must be within the set temp. process band or nothing will happen). Turn the selector switch to REMOVE or INSTALL completing the set-up. The machine is ready to go…………….

Board Width:

The location rails may be spread to accommodate an 18" x 24" panel.

Speed and Position:

The X and Z speed controls are repeatable to the reference vernier dial. The X speed can be set for the product heat sink characteristics. Use a slower setting for heavy, dense components and faster for less demanding time/temperature requirements.

The Solder Pot:

Most important is compatibility with lead-free alloys There are several other key aspects not mentioned in the data sheet that improve wave performance while reducing dross and associated maintenance. As examples the impeller is machined from solid stock and runs concentric to the pump shaft. This helps to mitigate wave flutter and dross formation. A graphite sleeve/bearing extends well under the solder surface providing a buffer interface at the solder surface, again reducing dross.

The entire area above the molten solder is inerted, captured under the full cover.

As the nitrogen escapes the enclosure it is channeled up around the nozzle further inerting the actual solder process. The Nitrogen present at the solder/PCB interface drastically reduces bridging and icicles.

An alarm light illuminates when a low solder condition occurs. The Operator should prepare a small supply of 4" lengths of 1/8" dia. solder (from a spool). When the light is on feed in 2 or 3 lengths until the light goes out. Depending on usage this may need to be done every ½-2 hours.

Solder Temperature Control:

A discrete P.I.D. controller is used displaying the set and actual temperature of the solder. A separate process band settable in one-degree increments insures that the process is never out of temperature.