Advanced Workshop

Become the expert within your Company

This course will enrich your understanding of how a PCB is constructed and how certain PCB manufacturing characteristics affect soldering, and is followed by demonstrations of the programming and process variables you can use control to achieve Class 3 solder joints.

Is the PCB design manufacturable?

  • Lead-to-hole ratio
  • SMT pad-to-hole ratio
  • Use of thermal relief patterns on inner-layers of multilayer boards
  • Solder access, keep-out areas, relief areas and breakaways

What PCB characteristics impact the soldering process?

  • Laminate choices, glass transition temper-ature and lead-free compatibility
  • Surface finishes (OSP, HASL, immersion silver and ENIG)
  • Cleanliness (ionic contamination, organic contamination and intermetallic growth)
  • Solder mask (matte, gloss and curing)
  • Copper weight (inner-layers and ground planes)
  • Through-hole plating thickness (copper barrel )
  • Board thickness and layer counts
  • Thermal relief patterns on inner-layers
  • Internal stress (warp, twist and bow)
  • Delamination and measling
  • Moisture entrapment

What parameters can the KISS machine adjust for?

  • Step and repeat patterns
  • Board separation distances
  • Singulation methods (mouse bites, v-score and router)
  • Assembly rails (size and location)
  • Tooling holes
  • Fiducials
  • Test coupons Optimize thermal transfer for effective soldering
  • Heat transfer and conductivity principles
  • Material properties necessary for solder action
  • Thermal coefficient of expansion (laminate and copper)

The course includes all of the following:

  • Classroom tutorial chaired by guest speaker and renowned fabrication expert Stan Bentley of DIVSYS International
  • Two days of hands-on training with our ACE manufacturing and technical team
  • Three nights lodging at a hotel nearby
  • Transportation to and from the Spokane airport
  • Breakfast, lunch and dinners

The ACE know-how makes for happy customers

Learn... advanced programming and process techniques

  • Use of diagonal breakaway with change of Z-axis
  • Pump speed change to draw off excess solder
  • Advantages of using subroutines
  • Programming around low hanging obstacles
  • Nozzle offset for sites adjacent to SMTs

How to reduce cycle time and increase productivity

  • When using custom stamp nozzles are practical
  • Dual fluxers and solder nozzles
  • Dual solder pump or dual nozzle set-up

Process secrets

  • Options and new fluxes available
  • Reducing flux residue for a true no-clean process
  • When to flux, preheat and flux again
  • Tacking one end of a long row component to minimize warpage
  • Using the spot preheat on ground pins
  • When and how to preheat a thick board
  • Dealing with weak or thin PCB or panel warpage during the soldering process
  • Understanding and reducing particle contamination in the solder joint
  • Solderability testing using a wetting balance tester
  • When and how to use support fixtures

Register Now

Join us for this Advanced Workshop being held at DIVSYS International located in Indianapolis, Indiana April 25th & 26th

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